Board-backed envelopes
Focke Meler systems for hot-melt adhesive application in board-backed envelopes
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In which products are the adhesives used?
- Board-backed envelopes with Peel & Seal silicone strips
- Side flaps and silicone seals
Type of adhesive used
- EVA carton glue for the flaps
- PSA adhesive for the Peel & Seal silicone strip
System components
- Micron 20 for the side flaps and Micron 10 for the Peel & Seal unit
- 3 heated hoses for the side flaps and one hose for Peel & Seal
- 3 NC-ND-1 guns for the flaps, 125-mm intermittent fast cutting head for Peel & Seal
- 4-channel controller, 2 encoders and 3 photocells
Mechanical requirements
- For automatic folding machines
Advantages of Focke Meler
- Focke Meler technology is designed and manufactured in-house. Made in the EU
- The highest quality and best performance at competitive prices
- We adapt to the specific needs of each application
- Equipment and spare parts sent the following day
- Technical and after-sales service
- International operations with worldwide distribution
- Global technical support direct from the head office, subsidiaries and partners