Meler at Ipack-ima, 19-23 May in Milan
Meler will be present at the Italian packaging exhibition Ipack-ima.
From 19 to 23 May we will be in Milan at the Ipack-ima exhibition, one of the most important trade fairs in the packaging technologies, processes and internal logistics industry. You will have the opportunity to discover our wide range of products and solutions for the application of hot melt adhesives at our Stand H30 K29, Hall 10.
You will be able to see first-hand the award-winning Micron series, now available with a gear pump, whose principal feature, like the rest of the range, is low energy consumption and efficient melting and pumping.
Also prominent in that range is the new Micron MOD, an instantaneous on-demand hot melt melter; you only consume what you need when you need.
We have added to our portfolio of hot melt adhesive applicators, highlighting in particular the Microprecision HS series for high-speed machines.These applicators stand out for their accuracy and reliability with their model designed according to the solenoid valve features. The results are precise dot and bead applications, perfect for demanding markets such as Packaging and Visual Arts. Just as interesting is the MU series, an extensive range of configurable applicators, able to adapt to any application need. This includes the entire range of MSU or MDU long-life modules.