Home > News > Focke Meler will attend the ALL4PACK packaging trade show in Paris.

Focke Meler will attend the ALL4PACK packaging trade show in Paris.

Our stand number is 5a N075.

The international ALL4PACK packaging trade show will be held at the end of 2016. This event takes place every two years and will be held in the Paris-Nord Villepinte exhibition centre from November 14 to 17.

On this occasion, Focke Meler will exhibit products such as its well-known Micron series with piston pump, which provides energy efficiency of up to 60% when compared to other equipment found in the market.

The Micron MOD, which features adhesive savings and preservation in perfect conditions due to its low demand fusion system, will also be present.

The company will also be showing its applicators, such as its microprecision applicator from the HS series, the last generation of Meler applicators for high-speed machines, capable of precise bead applications (dots or strokes), and the applicator from the MU series, which can be adjusted to any application need.

Lastly, we will be presenting a new product, the EFFIBEAD controller, which is ideal for the packaging industry. This firing device perfectly combines reliability with savings, since it only applies the required amount of adhesive.

Very satisfactory attendee numbers are expected for this newest edition of the trade show. All4pack will count on approximately 100,000 international professionals and 1,600 exhibitors.

Likewise, All4pack 2016 will be the international showcase for new technologies applied to packaging and printing processing and systems that reveal true upcoming trends.

This website uses own and third-party cookies to collect information about you, your browsing and your behaviour on the website for analytical purposes about your browsing habits. You can obtain more information about our Cookie Policy and access the cookie settings panel (including the possibility of rejecting their installation as a whole).